HOT DISK Thermal Conductivity Products


hotdisk 1 

The Hot Disk TPS 3500, TPS 2500 S, TPS 2200, TPS 1500, TPS 500 S, TPS 500 and the TPS 2500 S Dual are scientific instruments for determination of thermal conductivity, thermal diffusivity and specific heat capacity of solids, liquids, powders, pastes, foams as well as laminates. The instruments can be customized according to your wishes, and additional functionality is easy to add as interest arises. Hot Disk’s approach with recurrent software up-grades ensures low maintenance costs and up-to-date instruments for many years to come. Depending on the instrument model chosen, currently up to nine software modules are available, including: Isotropic Standard, One-Dimensional, Anisotropic, Slab, Thin Film, Specific Heat Capacity, Structural Probe, Low-Density / Highly-Insulating and Automatization modules. Along with the unique Hot Disk sensors, available in a range of sizes and three different materials, the TPS line of instruments likely constitutes the world’s most flexible system for analysing thermal properties.

hotdisk instruments

Instruments for Thermal Conductivity Measurements

Hot Disk offers a selection of instruments for testing and measuring thermal conductivity, thermal diffusivity and specific heat capacity.


hotdisk sensors

Thermal Conductivity Measurement Sensors 

The Hot Disk sensor, at its core, is an insulated nickel double spiral, which is utilized for both transient heating and precise temperature readings. The insulation material makes the sensor mechanically stable and very durable, and the use of nickel metal in the spiral makes the thermal conductivity measurements very accurate. To accommodate different material types and sample geometries, sensors with radii from 0.5 mm up to 30 mm are available. Furthermore the sensors’ insulation material can be Kapton (polyimide), mica (sheet silicate minerals) or Teflon (polytetrafluoroethylene - PTFE) to tackle different temperature ranges and/or extreme conditions.


hotdisk modules

Software Modules for Thermal Conductivity Measurements

Software Modules...